Aeroflex Microelectronic Solutions

Aeroflex Microelectronic Solution divisions - Colorado Springs, Gaisler, Metelics, Plainview and RAD provide HiRel standard and custom integrated circuits and circuit card assembly for the aerospace, high-altitude avionics, medical, x-ray cargo scanners, critical transportation systems, nuclear power controls, GPS receivers, networking and telecommunication markets.

HiRel Power MOSFETs

HiRel Power MOSFETs

Aeroflex RAD's new radiation tolerant power MOSFETs are now available in die, seven standard package options and custom packaging for HiRel environments. Applications within military, aerospace, medical, nuclear power generation, high energy physics research laboratories can benefit from the use of this new series of MOSFETs.

Key attributes of the Aeroflex RAD design
for these HiRel Power MOSFETS are low power losses through a unique combination
of low RDS(on) and gate charge while also optimizing the die size for maximum current rating.

The RAD7110-Ncx die is ideal for low loss switching applications, such as DC-to-DC converters and solid-state relays (SSR) and are drop-in compatible with industry standards.

Power MOSFETs feature highlights:
  • 100-250V Breakdown voltage
  • 1-60A current rating
  • RDSon from 10mOhms
  • Radiation Testing to MIL-STD-750, 100krad(Si)
  • SEGR/SEB immune to Xe at full drain potential
  • Available in die form or 7 different packaging options. Custom packaging also offered
  • Prototype, Electromechanical or “Class S” compliant variants
Power MOSFETs ( Breakdown Potential 100v)
Part
Number
View Datasheet
RDSon
(mOhms)
Drain
Current
(A)
Gate
Charge
(nC)
Total
Dose
krads(Si)
SEE *Die
Size
PackageScreening
RAD7110-NCx2203.515100Au, Xe1Bare DiePrototype,
EM, Space
RAD7110-NFx2503.515100Au, Xe1TO-39Prototype,
EM, Space
RAD7130-NCxTBDTBD50100Au, Xe3Bare DiePrototype,
EM, Space
RAD7130-NNJxTBDTBD50100Au, Xe3SMD 0.5Prototype,
EM, Space
RAD7130-NYxTBDTBD50100Au, Xe3TO-257AAPrototype,
EM, Space
RAD7160-NCx1060150100Au, Xe6Bare DiePrototype,
EM, Space
RAD7160-NNAx1345150100Au, Xe6SMD 2Prototype,
EM, Space
RAD7160-NMx1835150100Au, Xe6TO-254AAPrototype,
EM, Space
Power MOSFETs ( Breakdown Potential 150v)
Part
Number
RDSON
(mOhms)
Drain
Current
(A)
Gate
Charge
(nC)
Total
Dose
krads(Si)
SEE *Die
Size
PackageScreening
RAD7114-NCx6002.215100Au, Xe1Bare DiePrototype,
EM, Space
RAD7114-NFx6302.215100Au, Xe1TO-39Prototype,
EM, Space
RAD7134-NCxTBDTBD50100Au, Xe3Bare DiePrototype,
EM, Space
RAD7134-NNJxTBDTBD50100Au, Xe3SMD 0.5Prototype,
EM, Space
RAD7134-NYxTBDTBD50100Au, Xe3TO-257AAPrototype,
EM, Space
RAD7164-NCx2435150100Au, Xe6Bare DiePrototype,
EM, Space
RAD7164-NNAx2735150100Au, Xe6SMD 2Prototype,
EM, Space
RAD7164-NMx3235150100Au, Xe6TO-254AAPrototype,
EM, Space
Power MOSFETs ( Breakdown Potential 200v)
Part
Number
RDSON
(mOhms)
Drain
Current
(A)
Gate
Charge
(nC)
Total
Dose
krads(Si)
SEE *Die
Size
PackageScreening
RAD7210-NCx7002.015100Au, Xe1Bare DiePrototype,
EM, Space
RAD7210-NFx7302.015100Au, Xe1TO-39Prototype,
EM, Space
RAD7230-NCxTBDTBD50100Au, Xe3Bare DiePrototype,
EM, Space
RAD7230-NNJxTBDTBD50100Au, Xe3SMD 0.5Prototype,
EM, Space
RAD7230-NYxTBDTBD50100Au, Xe3TO-257AAPrototype,
EM, Space
RAD7260-NCx3430150100Au, Xe6Bare DiePrototype,
EM, Space
RAD7260-NNAx3730150100Au, Xe6SMD 2Prototype,
EM, Space
RAD7260-NMx4230150100Au, Xe6TO-254AAPrototype,
EM, Space
Power MOSFETs ( Breakdown Potential 250v)
Part
Number
RDSON
(mOhms)
Drain
Current
(A)
Gate
Charge
(nC)
Total
Dose
krads(Si)
SEE *Die
Size
PackageScreening
RAD7214-NCx12001.515100Au, Xe1Bare DiePrototype,
EM, Space
RAD7214-NFx12001.515100Au, Xe1TO-39Prototype,
EM, Space
RAD7234-NCx200950100Au, Xe3Bare DiePrototype,
EM, Space
RAD7234-NNJx200950100Au, Xe3SMD 0.5 Prototype,
EM, Space
RAD7234-NYx12001.215100Au, Xe3TO-257AAPrototype,
EM, Space
RAD7214-NQx1200 1.215100Au, XeQuadLCC-28Prototype,
EM, Space
RAD7214-NGx12001.215100Au, XeQuadDIP-14Prototype,
EM, Space
RAD7264-NCx5128150100Au, Xe6Bare DiePrototype,
EM, Space
RAD7264-NNAx5428150100Au, Xe6SMD 2Prototype,
EM, Space
RAD7264-NMx5928150100Au, Xe6TO-254AAPrototype,
EM, Space
* x = P for prototypes, E for engineering samples, S for Class S.
Aeroflex RAD MOSFET Numbering
RAD 7 1 1 0 - N M P X
TID
Level
Break-
down
Die
Size
Breakdown
Adder
Channel
Type
Package Screening Technology
7 -
100krad (Si)
1 - 100V
2 - 200V
1 - Size 1
3 - Size 3
6 - Size 6
0 - None
3 - 30V
4 - 50V
N - N Type
P - P Type
M - Mixed
C - Bare Die
F - TO39
NJ - SMD 0.5
M - TO254AA
Q - LCC 28 Pin
G - DIP 14 Pin
NA - SMD 2
Y - TO-257AA
P - Proto
E - EM
S - Space
Reserved
SEE Single-Event Effects: Units exhibit immunity to SEGR and SEB at listed ion when tested at full rated drain potential
and in the off-state. The following ion characteristics were used: Xe, 10MeV/n Berkeley beam. Initial LET of
approximately 60MeV-cm2/mg. Au, 1.7MeV/n Brookhaven beam. Initial LET of approximately 84MeV-cm2/mg.
See SEB/SEGR reports for full details.